Product Description
- CCS Technology reduces polish rate of absorption
- Reduced surface tension prevents pad skidding
- CCS pockets reduce friction generated heat
- Velcro/ hook and loop backing
Improved Operator Control
Engineered design allows pad to glide over surfaces by reducing pad skipping on the buffing surface.
Runs Cooler
Designed channels allow the pad to run cooler on the surface.
•Minimizing Splatter
Cross-Cut nubs hold the polish on the pad surface longer, reducing clean up and product waste.
