Background of CCS Technology:
Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology™ solves this common problem using strategic patterns of partially closed f
Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
Creates less Heat – CCS pockets reduce surface contact resulting in less friction generated heat.